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Senior Photonics Packaging Engineer

Phanofi · CVR 43590324

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Salary not stated Danish not required On-site Kgs. Lyngby Imported from Jobnet

The Mission Phanofi is a DTU spin-out building the next generation of optical communication infrastructure. We design integrated photonic interconnect chips that reduce power consumption and increase data throughput for AI datacenters, quantum computing, and space applications. Getting photonic integrated circuits (PICs) out of the lab and into packaged, manufacturable modules is one of the hardest problems in our field, and often the one that decides whether a promising chip becomes a product. As a diverse team of 16, we are at an inflection point, growing our engineering capability to take …

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